Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics.

According to Figure 7 , at a grinding depth of 12 μm and a feed rate of 3500 mm/min, when the wheel speed increased from 25 to 45 m/s, the grinding temperature rose from 423 to 627 °C ( Figure 7 a), showing an increasing trend.

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At a grinding depth of 12 μm and a wheel speed of 38 m/s, when the feed rate increased from 1000 to 7000 mm/min, the grinding temperature decreased from 623 to 429 °C ( Figure 7 c), showing a decreasing trend.

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