Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials.

Materials (Basel) · 2023 · PMC10220926 · PMID 37241395

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a decreasing trendno p-value reported

As depicted, with the increase in HGM content, the thermal conductivity of the composite material shows a decreasing trend.

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an increasing trendno p-value reported

As shown in Figure 9 , the elastic modulus of the composite material shows an increasing trend with the increase in HGM content.

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