Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes.

Nanomaterials (Basel) · 2023 · PMC10421339 · PMID 37570472

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a decreasing trendno p-value reported

At approximately 200 °C, the mass of GO decreases, and at approximately 400 °C, the mass of PVA decreases, showing a decreasing trend in the graph. 3.3.

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