Process Analysis and Topography Evaluation for Monocrystalline Silicon Laser Cutting-Off.

(2) Crack width: when the laser scanning speed exceeds 100 mm/s, the groove width gradually decreases with the increase in the laser scanning speed but when the laser scanning speed is too small (50 mm/s), the groove width also has a decreasing trend.

also in 47,180 other papers

The identification of the thermal damage and cutting conditions of six groups of laser cutting experiments in which the cutting times were even shows that with the increase in the test times, the material’s groove width, the width of the machining affected zone, and the groove width after chip removal have an increasing trend.

also in 63,971 other papers