Low temperature soldering technology based on superhydrophobic copper microlayer.

Heliyon · 2024 · PMC10979162 · PMID 38560103

Europe PMC DOI

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a decreasing trendno p-value reported

However, when the soldering pressure exceeded 33 MPa and the soldering temperature exceeded 220 °C, a decreasing trend in the average shear strength of the soldered joints was found.

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