Newly developed lead-free alloy systems have been discovered that can successfully replace them [ 16 ], such as those in the binary Sn-Cu, Sn-Ag, Sn-Bi, Sn-Zn, Sn-In, and Sn-Sb systems or the ternary Sn-Zn-Bi and Sn-Ag-Cu systems (SAC solders), with acceptable properties (melting temperature, mechanical properties, microstructure, wettability, solder ability, reliability, and cost), thus offering a positive trend in terms of finding new variants of accessible lead-free soldering alloys with properties similar to those prohibited [ 6 , 7 , 8 , 9 , 10 , 11 , 13 ].
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Thermodynamic Assessment of Molten Bi<sub>x</sub>-Sn<sub>1-x</sub> (x = 0.1 to 0.9) Alloys and Microstructural Characterization of Some Bi-Sn Solder Alloys.
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