Effects of HiPIMS Duty Cycle on Plasma Discharge and the Properties of Cu Film.

Figure 6 shows the SEM images of copper films deposited by HiPIMS under different duty cycle conditions, and it is found that the particle size on the surface of the copper film shows an increasing trend with increasing duty cycle.

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Under the conditions of a 4.5% and 5.25% duty cycle, the target peak current shows a decreasing trend.

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