Through the interactions, it is possible to observe that the modulus of elasticity for CuO nanoparticles showed a decreasing trend with increasing temperature ( Figure 5 a).
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Influence of Pressing Temperatures on Physical-Mechanical Properties of Wood Particleboards Made with Urea-Formaldehyde Adhesive Containing Al<sub>2</sub>O<sub>3</sub> and CuO Nanoparticles.
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Introduction Particleboards have been increasingly used, with a favorable trend for the coming decades [ 1 , 2 ].