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Influence of Pressing Temperatures on Physical-Mechanical Properties of Wood Particleboards Made with Urea-Formaldehyde Adhesive Containing Al<sub>2</sub>O<sub>3</sub> and CuO Nanoparticles.

Polymers (Basel) · 2024 · PMC11207620 · PMID 38932002

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a decreasing trendno p-value reported
Through the interactions, it is possible to observe that the modulus of elasticity for CuO nanoparticles showed a decreasing trend with increasing temperature ( Figure 5 a).

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a favorable trendno p-value reported
Introduction Particleboards have been increasingly used, with a favorable trend for the coming decades [ 1 , 2 ].

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