Preparation of Imidazole Compounds as Latent Curing Agents and Their Application in RGB LED Packaging.

Materials (Basel) · 2024 · PMC11477733 · PMID 39410503

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a decreasing trendno p-value reported

As shown in Figure 4 , after 540 cycles of rapid temperature change, the shear strength of the chip–substrate joint showed a decreasing trend.

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