Bioinspired thermally conducting packaging for heat management of high performance electronic chips.

Commun Eng · 2025 · PMC11700189 · PMID 39755785

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an increasing trendno p-value reported

The thermal resistance of P-A reaches its minimum value of 0.23 °C W −1 at a heat load of 110 W, undergoing a transition where the decreasing trend shifts to an increasing trend.

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