Study on Quantitative Adjustment of CD Bias and Profile Angle in the Wet Etching of Cu-Based Stacked Electrode.

Materials (Basel) · 2024 · PMC11721414 · PMID 39795761

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a decreasing trendno p-value reported

As illustrated in Figure 10 c, the PAs of the MoNb/Cu electrode remained stable with increasing Cu ion concentration, but those of the MoNb/Cu/MTD electrode showed a decreasing trend.

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