Thermoelectric Cooling Performance Enhancement in BiSeTe Alloy by Microstructure Modulation via Hot Extrusion.

Small Sci · 2024 · PMC11935137 · PMID 40212357

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an increasing trendno p-value reported

The temperature‐dependent variation of the Seebeck coefficient reveals an initial decreasing trend followed by an increasing trend beyond 370 K, suggesting bipolar conduction behavior.

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