Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications.

Micromachines (Basel) · 2025 · PMC12298965 · PMID 40731655

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an increasing trendno p-value reported

These reasons lead to an increasing trend of stress–strain in the SL along the X-axis from the center to both sides.

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