Study on Nano-Grinding Characteristics and Formation Mechanism of Subsurface Damage in Monocrystalline Silicon.

As demonstrated in Figure 10 , with increasing grinding speed from 100 m/s to 250 m/s, both the normal and tangential forces show a decreasing trend, while the force in the tangential direction remains larger than that in the normal direction.

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However, in the stable grinding stage beyond a distance of 12 nm, the grinding temperature shows an increasing trend with increasing grinding speed.

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