Unravelling Cu<sub>6</sub>Sn<sub>5</sub> precipitate coarsening mechanisms in SAC solders under thermomechanical cycling.

However, both mean values lie within the standard deviation of the other, respectively, suggesting that strain-induced coarsening of Cu 6 Sn 5 -precipitates at room temperature also might saturate at large degrees of deformation.Nonetheless, an overall trend of increasing Cu 6 Sn 5 -precipitate size with increasing deformation is observed in Fig. 1 c.

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