Constitutive Model of Secondary Annealing Behavior of Cu-Cu Joints in Cu/SiO<sub>2</sub> Hybrid Bonding.

Materials (Basel) · 2025 · PMC12654346 · PMID 41303997

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a decreasing trendno p-value reported

It is evident that both yield strength and hardness exhibit a decreasing trend as the grain size increases.

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Constitutive Model of Secondary Annealing Behavior of Cu-Cu Joints in Cu/SiO&lt;sub&gt;2&lt;/sub&gt; Hybrid Bonding.

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Constitutive Model of Secondary Annealing Behavior of Cu-Cu Joints in Cu/SiO<sub>2</sub> Hybrid Bonding.