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Simulation Analysis of the Chemical Mechanical Polishing Process for Monocrystal 4H-Silicon Carbide Based on Molecular Dynamics.

Micromachines (Basel) · 2025 · PMC12735350 · PMID 41470516

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an increasing trendno p-value reported
It can be seen that the Si-C bond keeps decreasing during simulation, while the Si-O and C-O show an increasing trend.

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