Thermally Induced Creep and Viscoelastic Behavior of Copper Micropillar Arrays.

Adv Sci (Weinh) · 2026 · PMC13088336 · PMID 41703991

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an increasing trendno p-value reported

After heat treatment from room temperature up to 200°C, the value of M t − n × ρ − n /2 exhibits an increasing trend.

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