Atomic-Scale Mechanisms and Damage Suppression in Nanometric Cutting of Polycrystalline Copper: A Molecular Dynamics Study.

As shown in Figure 17 a–d, when the ambient temperature increases from 297 K to 897 K, the atomic displacement deformation in both the cutting deformation zone and the subsurface region exhibits an increasing trend.

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As shown in Figure 7 a–c, the von Mises stress within the cutting deformation zone exhibits a decreasing trend with increasing average grain size, indicating that smaller grain sizes lead to more severe stress concentration during cutting.

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