Under the fitting conditions employed in this study, the proportion of oxygen vacancies exhibits a decreasing trend with increasing annealing temperature: following annealing at 350 °C, 400 °C and 450 °C, the relative proportions of oxygen vacancies obtained from the fitting were 17.9%, 13.0% and 12.9%, respectively.
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Solution-Processed High-k HfO<sub>2</sub> Gate Insulator for High-Performance Indium-Zinc-Oxide Thin-Film Transistors: Optimisation of Annealing Temperature and Insulator Thickness.
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