An integrated framework TSV-INet for arbitrarily distributed TSV interposer wafer warpage simulation.

Microsyst Nanoeng · 2026 · PMC13328617 · PMID 42393023

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a notable trendno p-value reported

A notable trend is also observed among the CNN-only baselines: with sufficient training data, larger-capacity CNNs tend to outperform lightweight ones in this task, yet all remain inferior to TSV-INet.

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