An Efficient Numerical Homogenization Method for Multi-Scale Modeling of 2.5D Package Warpage and Thermal Analysis.

Micromachines (Basel) · 2026 · PMC13413784 · PMID 42513064

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a decreasing trendno p-value reported

Only when the SiO 2 layer is absent does the junction temperature exhibit a decreasing trend with higher Cu content.

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