Interfacial Microstructure Evolution and High-Speed Ball Shear Fracture of SAC305/Cu-20wt%Zn Solder Joints Under Isothermal Aging.

Materials (Basel) · 2026 · PMC13414090 · PMID 42513872

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a decreasing trendno p-value reported

With increasing aging time, both groups showed a decreasing trend, but with different characteristics.

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