Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates.

Sensors (Basel) · 2017 · PMC5424734 · PMID 28420088

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a decreasing trendno p-value reported

The compressive shear stress and the tensile shear stress show a decreasing trend upon moving away from the film edge.

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