Thermoconductive Thermosetting Composites Based on Boron Nitride Fillers and Thiol-Epoxy Matrices.

[ 15 ] observed that the reaction kinetics of a thiol-epoxy system was affected by the amount of BN filler added to the formulation, showing an unexpected trend, firstly increasing the curing rate and then retarding it as the filler content increases, without affecting the final cured epoxy network structure.

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As we can see, there is an increasing trend, although small, in gelation time on increasing the BN proportion.

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