Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.

Materials (Basel) · 2021 · PMC7915092 · PMID 33562200

Europe PMC DOI

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an increasing trendno p-value reported

(b) The total thickness of interfacial IMC (both Cu 6 Sn 5 and Cu 3 Sn) layer showed an increasing trend for non-reinforced SAC305 and SAC305-KGC composite solder joints which was about ~6–17 μm.

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