Silicon Nitride and Hydrogenated Silicon Nitride Thin Films: A Review of Fabrication Methods and Applications.

Materials (Basel) · 2021 · PMC8510430 · PMID 34640056

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a decreasing trendno p-value reported

Deposition (tensile) stress was varied in the range of 135–235 MPa and showed a decreasing trend with higher fabrication temperatures, pressures, and precursor ratios.

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an increasing trendno p-value reported

Measured hardness values were in the range of 16.1–19.8 GPa and showed an increasing trend against the increasing Si/N ratio.

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