FEM Analysis of Various Multilayer Structures for CMOS Compatible Wearable Acousto-Optic Devices.

Sensors (Basel) · 2021 · PMC8659981 · PMID 34883867

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a decreasing trendno p-value reported

The overall electromechanical coupling coefficient behaviour showed a decreasing trend with increased normalised thicknesses of SiO 2 .

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