Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter.

Sensors (Basel) · 2022 · PMC8950703 · PMID 35336284

Europe PMC DOI

hedged sentence

—

closest p

—

boldest claim

The sentences

a decreasing trendno p-value reported

We found that all the layers showed a decreasing trend in the shear strength during the early stage.

also in 47,180 other papers

Quoted from the open-access full text in Europe PMC under the licence the publisher applied. The sentence is reproduced exactly as published; the emphasis is ours.