1-(4-Hydroxyphenyl)-2<i>H</i>-tetrazole-5-thione as a leveler for acid copper electroplating of microvia.

RSC Adv · 2022 · PMC9152711 · PMID 35733656

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a decreasing trendno p-value reported

3(a and b) shows a decreasing trend for all four curves when PMT/HPTT are added at 500 s, respectively.

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an increasing trendno p-value reported

There is almost no difference between the deposition potentials at 100 rpm and 1000 rpm, and they both show an increasing trend, suggesting that SPS is slowly replacing the PEP adsorbed on the copper surface.

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