Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO<sub>2</sub> Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing.

Micromachines (Basel) · 2022 · PMC9695507 · PMID 36363877

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an unexpected trendno p-value reported

On the other hand, an unexpected trend is observed from employing Ar instead of N 2 or O 2 plasma.

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