Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates.

Heliyon · 2023 · PMC9898020 · PMID 36747560

Europe PMC DOI

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closest p

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a decreasing trendno p-value reported

The wettability maintaines a decreasing trend with the decrease of Ag.

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