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Thermal and Mechanical Characterization of Epoxy/Polyimide Blends via Postcuring Process.

Polymers (Basel) · 2023 · PMC10007675 · PMID 36904313

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showed a trendno p-value reported
The crosslinking density and T g of the EPI showed a trend to decrease with increasing PI content in the blend, which was lower than that of pure EP.

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