Emergent Magnonic Materials: Challenges and Opportunities.

Materials (Basel) · 2023 · PMC10533023 · PMID 37763576

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In Figure 9 c, the dependence of the total damping parameter on Cu buffer layer thickness is provided, and it exhibits a clear trend: as the Cu buffer layer thickness increases, the thin film stack RMS roughness increases, which, in turn, reduces the total damping.

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