Surface Roughness-Induced Changes in Important Physical Features of CoFeSm Thin Films on Glass Substrates during Annealing.

Hardness and Young’s Modulus Figure 4 a,b reveals a clear trend where the hardness and Young’s modulus of CoFeSm thin films decreased with increasing film thickness and annealing temperature.

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In Figure 7 a, an increasing trend in contact angle at room temperature (RT) is depicted within the thickness range of 10 nm to 30 nm, followed by a subsequent decrease within the range of 30 nm to 50 nm, specifically for the testing liquid DI water.

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Additionally, an interesting trend became apparent as the maximum χ ac value increased with both film thickness and annealing temperature due to the thickness effect and smoother surface.

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