Improvement of PbSn Solder Reliability with Ge Microalloying-Induced Optimization of Intermetallic Compounds Growth.

Materials (Basel) · 2024 · PMC10856678 · PMID 38591612

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a clear trendno p-value reported

After 1000 temperature cycles, 20 reflows or 1000 h high-temperature storage, the IMCs’ morphology slightly roughened, showing a clear trend of scalloping.

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