A Study on the Reliability Evaluation of a 3D Packaging Storage Module under Temperature Cycling Ultimate Stress Conditions.

Micromachines (Basel) · 2024 · PMC11052348 · PMID 38675240

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a clear trendno p-value reported

Moreover, within a single chip, the stress on the contact surface between the solder joints and the chip shows a clear trend of a diffusion distribution along the center of the chip.

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