Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls.

J Mater Sci Mater Electron · 2025 · PMC12130131 · PMID 40470271

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a clear trendno p-value reported

A clear trend was found in Sn-0.5Ag, Sn-2Ag and Sn-3.5Ag that solder balls with deeper β-Sn nucleation undercooling were more likely to have multiple β-Sn grains, in agreement with past work by Arfaei et al.

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