Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum.

Materials (Basel) · 2025 · PMC12348621 · PMID 40805511

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closest p

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a clear trendno p-value reported

This conclusion was based on the comparison of average values obtained from the tested specimens, with a clear trend of improved wettability at higher temperatures.

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