These findings establish a clear trend: the incorporation of HMPA most effectively slows Zn plating kinetics, promoting more uniform deposition accompanied by a kinetically irreversible regime, whereas the baseline Zn(OTf) 2 system exhibits the fastest, and consequently less controlled, electrodeposition behavior.
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Amide additives enhance the understanding of kinetic reversibility in zinc anode stability using ultramicroelectrodes.
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