Chemical Mechanical Polishing of Plasma-Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.

Adv Sci (Weinh) · 2026 · PMC12806195 · PMID 41159511

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closest p

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a clear trendno p-value reported

While the untreated BCB exhibited a low nano‐scale hardness of 0.3 GPa, p‐BCB (at 40 W) showed a hardness exceeding 1.0 GPa, with a clear trend of increasing hardness at higher plasma power.

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