Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review.

Micromachines (Basel) · 2019 · PMC6631602 · PMID 31248121

Europe PMC DOI

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a significant trendno p-value reported

Transient liquid-phase bonding is capable of bonding at low temperature and servicing at high temperature, which is a significant trend in the field of high-temperature packaging for SiC power modules.

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