Applying microscopic analytic techniques for failure analysis in electronic assemblies.

Keywords Failure analysis Printed circuit boards Cross-section Optical microscopy SEM-EDS pmc-status-qastatus 0 pmc-status-live yes pmc-status-embargo no pmc-status-released yes pmc-prop-open-access yes pmc-prop-olf no pmc-prop-manuscript no pmc-prop-legally-suppressed no pmc-prop-has-pdf yes pmc-prop-has-supplement no pmc-prop-pdf-only no pmc-prop-suppress-copyright no pmc-prop-is-real-version no pmc-prop-is-scanned-article no pmc-prop-preprint no pmc-prop-in-epmc yes pmc-license-ref CC BY issue-copyright-statement © The Author(s) 2019 Introduction The electronic industry has shown a clear trend to miniaturization with increasing functionality.

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