Identification and Evolution of Core Technologies in the Chip Field Based on Patent Networks.

(2) Control Pattern Analysis of Advanced Packaging Technologies Evolution trajectory analysis of 3D stacking packaging technology indicates a clear trend toward technological control centralization in this field.

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At this stage, the patent layout covered 11 markets, including North America and East Asia, and the technology diffusion showed a trend of global penetration.

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Notably, with the gradual decline in entropy values, the technology citation network exhibits a significant trend of transformation from cross-border multi-directional flow patterns toward regional closed-loop patterns.

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